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Wafer Backgrinding Tape Market by Type (UV Curable and Non-UV) and Wafer Size (6 Inch, 8 Inch, 12 Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2019-2026

SE_195394
Pages: 199
Jul 2019 | 137 Views
 
Author(s) : Asavari Patil & Divyanshi Tewari , Supradip Baul
Tables: 78
Charts: 59
 

Wafer Backgrinding Tape Market Outlook-2026

The global wafer backgrinding tape market size is expected to reach $261.42 million by 2026, growing at a CAGR of 4.90% from 2019 to 2026. Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.

Wafer Backgrinding Tape Market

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Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple. On 14th March 2017, Furukawa Electric Co., launched “Plasma Masked Backgrind Tape” for laser grooving and plasma dicing. The tape is expected to improve the quality of chips and wafers.

Wafer Backgrinding Tape Market By Type

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The factors such as increase in demand for ultra-thin wafers, rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tape market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth.

Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for the market expansion.

Segmentation

The global wafer backgrinding tape market is segmented on the basis of type, wafer size, and region. Based on type, the market is bifurcated into UV curable and non-UV tape types. Based on wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

Wafer Backgrinding Tape Market By Size

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The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Wafer Backgrinding Tape Market By Regional

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Top Impacting Factors

The factors such as increase in demand for ultra-thin wafers, rise in need for wafer fabrication, increase in focus towards wafer surface protection during grinding process, growth in semiconductor industry, increase in cost of wafer fabrication and increase in investment in wafer fabrication equipment and materials are expected to significantly affect the growth of the global wafer backgrinding tape market. These factors are anticipated to either drive or hamper the market growth.

Rise In Need for Wafer Fabrication

Semiconductor wafer fabrication is a procedure that is composed of many sequential processes to produce electrical circuits or semiconductor wafers. Wafer fabrication helps in building components with required electrical structures. Wafer fabrication process is carried out for processing raw wafers to finished chips (discrete or integrated circuits). The factors such as high demand for silicon wafer and equipment footprint in fabrication procedure help analyzing the semiconductor wafer fabrication and its equipment market globally in the future. Moreover, innovations in wafer technologies that have led to denser packaging of devices such as MEMS (micro-electro-mechanical system) and transistors are expected to drive the need for wafer fabrication procedure in the semiconductor market globally. In addition, various advances in semiconductor fabrication have emerged to build small and cost-effective single chip integrated radar systems operating at millimeter-wave frequencies and beyond. These tiny radar systems will enable a wide range of new applications such as automotive radar, safety helmet radar, robot guidance radar, UAV collision avoidance and mapping radar, bicycle safety radar, and many other possibilities, which are anticipated to provide lucrative opportunities for the market growth.

Increase In Cost of Wafer Fabrication

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. As wafer backgrinding tapes protect the wafer surface from contamination, there is a growing transition from non-UV tapes toward UV curable tapes. UV curable tapes as against conventional backgrinding tapes provide enhanced wafer surface protection from contamination with efficient adhesive quality. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple. This feature of UV curable backgrinding tapes provides it a competitive edge against non-UV backgrinding tapes. Moreover, these tapes incur an extra cost as against non-UV backgrinding tapes. This is expected to add up the overall wafer manufacturing cost by making it slightly expensive. This increase in shift from non-UV to UV curable backgrinding tapes increase the overall cost of wafer manufacturing, which is expected to hamper the backgrinding tape market up to a certain level.

Increase In Investment In Wafer Fabrication Equipment And Materials

There is an increase in trend toward growing investments in wafer fabrication equipment and materials, which provides lucrative growth opportunities for the semiconductor industry. Governments of various developing regions such as South Korea, Taiwan, and China are setting up regulations to uplift the semiconductor industry by adopting strategies such as business expansion, acquisition, and various product launches, among others. For instance, Shanghai Jita Semiconductor, a subsidiary of Huada Semiconductor and China Electronics Corporation (CEC), announced to build both 200 mm and 300 mm semiconductor fabs for analog and power semiconductors in Shanghai from 2019. The combined fab investment will total up to $5.18 billion. In addition, Hamamatsu, a semiconductor company based in Japan announced that it is building a new facility investment of 2.8 billion Yen (US$25 million) to boost the semiconductor capacity in the country. All these investments drive the demand for wafers, IC’s, and chips markets, which in turn creates lucrative opportunities for wafer backgrinding process and wafer backgrinding tape market globally.

Key Benefits For Wafer Backgrinding Tape Market:

  • This study comprises analytical depiction of the global wafer backgrinding tape market size along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall wafer backgrinding tape market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current wafer backgrinding tape market forecast is quantitatively analyzed from 2019 to 2026 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the wafer backgrinding tape industry.
  • The report includes the wafer backgrinding tape market share of key vendors and wafer backgrinding tape market trends.

Wafer Backgrinding Tape Market Segmentation:

By Type

  • UV Curable
  • Non-UV

By Wafer Size

  • 6-Inch
  • 8-Inch
  • 12-Inch
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Russia
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East & Africa
 

CHAPTER 1:    INTRODUCTION

1.1.    Report description
1.2.    Key benefits for stakeholders
1.3.    Key market segments
1.4.    Research methodology

1.4.1.    Primary research
1.4.2.    Secondary research
1.4.3.    Analyst tools and models

CHAPTER 2:    EXECUTIVE SUMMARY

2.1.    CXO perspective

CHAPTER 3:    MARKET OVERVIEW

3.1.    Market definition and scope
3.2.    Key findings

3.2.1.    Top impacting factors
3.2.2.    Top investment pockets
3.2.3.    Top winning strategies

3.3.    Porter’s five forces analysis
3.4.    Market share analysis (2018)
3.5.    Market dynamics

3.5.1.    Drivers

3.5.1.1.    Increase in demand for ultra-thin wafers
3.5.1.2.    Rise in need for wafer fabrication
3.5.1.3.    Increase in focus toward wafer surface protection during grinding process
3.5.1.4.    Growth in the semiconductor industry

3.5.2.    Restraint

3.5.2.1.    Increase in cost of wafer manufacturing

3.5.3.    Opportunities

3.5.3.1.    Increase in investment in wafer fabrication equipment and materials

3.6.    Wafer manufacturing overview
3.7.    Wafer fabrication

3.7.1.    Types of wafer fabrication process

3.7.1.1.    Front-end process
3.7.1.2.    Back-end process

3.7.2.    Processes involved during wafer fabrication

3.7.2.1.    Oxidation
3.7.2.2.    Lithography
3.7.2.3.    Deposition
3.7.2.4.    Etching
3.7.2.5.    Chemical Mechanical Planarization
3.7.2.6.    Ion implementation
3.7.2.7.    Assembly and testing
3.7.2.8.    Diffusion

3.7.3.    Wafer grinding process (wafer thinning)
3.7.4.    Type of wafer thinning

3.7.4.1.    Conventional grinding
3.7.4.2.    CMP

3.7.5.    Machines and components required during wafer backgrinding

3.8.    Backgrinding tapes customer applications and usage

3.8.1.    Customer applications of backgrinding tape
3.8.2.    Usage of backgrinding tape

3.9.    Technology trends

3.9.1.    Materials used in tapes
3.9.2.    Technologies used to reduce the cycle time of backgrinding process
3.9.3.    Upgrades in tape manufacturing machines

CHAPTER 4:    WAFER BACKGRINDING TAPE MARKET, BY TYPE

4.1.    Overview
4.2.    UV Curable

4.2.1.    Key market trends, growth factors, and opportunities
4.2.2.    Market size and forecast, by region
4.2.3.    Market analysis, by country

4.3.    Non-UV

4.3.1.    Key market trends, growth factors, and opportunities
4.3.2.    Market size and forecast, by region
4.3.3.    Market analysis, by country

CHAPTER 5:    WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE

5.1.    Overview
5.2.    6-Inch

5.2.1.    Key market trends, growth factors, and opportunities
5.2.2.    Market size and forecast, by region
5.2.3.    Market analysis, by country

5.3.    8-Inch

5.3.1.    Key market trends, growth factors, and opportunities
5.3.2.    Market size and forecast, by region
5.3.3.    Market analysis, by country

5.4.    12-Inch

5.4.1.    Key market trends, growth factors, and opportunities
5.4.2.    Market size and forecast, by region
5.4.3.    Market analysis, by country

5.5.    Others

5.5.1.    Key market trends, growth factors, and opportunities
5.5.2.    Market size and forecast, by region
5.5.3.    Market analysis, by country

CHAPTER 6:    WAFER BACKGRINDING TAPE MARKET, BY REGION

6.1.    Overview
6.2.    North America

6.2.1.    Key market trends, growth factors, and opportunities
6.2.2.    Market size and forecast, by type
6.2.3.    Market size and forecast, by wafer size
6.2.4.    Market analysis, by country

6.2.4.1.    U.S.

6.2.4.1.1.    Market size and forecast, by type
6.2.4.1.2.    Market size and forecast, by wafer size

6.2.4.2.    Canada

6.2.4.2.1.    Market size and forecast, by type
6.2.4.2.2.    Market size and forecast, by wafer size

6.2.4.3.    Mexico

6.2.4.3.1.    Market size and forecast, by type
6.2.4.3.2.    Market size and forecast, by wafer size

6.3.    Europe

6.3.1.    Key market trends, growth factors, and opportunities
6.3.2.    Market size and forecast, by type
6.3.3.    Market size and forecast, by wafer size
6.3.4.    Market analysis, by country

6.3.4.1.    U.K.

6.3.4.1.1.    Market size and forecast, by type
6.3.4.1.2.    Market size and forecast, by wafer size

6.3.4.2.    Germany

6.3.4.2.1.    Market size and forecast, by type
6.3.4.2.2.    Market size and forecast, by wafer size

6.3.4.3.    France

6.3.4.3.1.    Market size and forecast, by type
6.3.4.3.2.    Market size and forecast, by wafer size

6.3.4.4.    Russia

6.3.4.4.1.    Market size and forecast, by type
6.3.4.4.2.    Market size and forecast, by wafer size

6.3.4.5.    Rest of Europe

6.3.4.5.1.    Market size and forecast, by type
6.3.4.5.2.    Market size and forecast, by wafer size

6.4.    Asia-Pacific

6.4.1.    Key market trends, growth factors, and opportunities
6.4.2.    Market size and forecast, by type
6.4.3.    Market size and forecast, by wafer size
6.4.4.    Market analysis, by country

6.4.4.1.    China

6.4.4.1.1.    Market size and forecast, by type
6.4.4.1.2.    Market size and forecast, by wafer size

6.4.4.2.    Japan

6.4.4.2.1.    Market size and forecast, by type
6.4.4.2.2.    Market size and forecast, by wafer size

6.4.4.3.    Taiwan

6.4.4.3.1.    Market size and forecast, by type
6.4.4.3.2.    Market size and forecast, by wafer size

6.4.4.4.    South Korea

6.4.4.4.1.    Market size and forecast, by type
6.4.4.4.2.    Market size and forecast, by wafer size

6.4.4.5.    Rest of Asia-Pacific

6.4.4.5.1.    Market size and forecast, by type
6.4.4.5.2.    Market size and forecast, by wafer size

6.5.    LAMEA

6.5.1.    Key market trends, growth factors, and opportunities
6.5.2.    Market size and forecast, by type
6.5.3.    Market size and forecast, by wafer size
6.5.4.    Market analysis, by country

6.5.4.1.    Latin America

6.5.4.1.1.    Market size and forecast, by type
6.5.4.1.2.    Market size and forecast, by wafer size

6.5.4.2.    Middle East & Africa

6.5.4.2.1.    Market size and forecast, by type
6.5.4.2.2.    Market size and forecast, by wafer size

CHAPTER 7:    COMPANY PROFILES

7.1.    AI TECHNOLOGY, INC.

7.1.1.    Company overview
7.1.2.    Company snapshot
7.1.3.    Product portfolio

7.2.    AMC CO., LTD

7.2.1.    Company overview
7.2.2.    Company snapshot
7.2.3.    Product portfolio

7.3.    DENKA COMPANY LIMITED

7.3.1.    Company overview
7.3.2.    Company snapshot
7.3.3.    Operating business segments
7.3.4.    Product portfolio
7.3.5.    Business performance

7.4.    FURUKAWA ELECTRIC CO., LTD.

7.4.1.    Company overview
7.4.2.    Company snapshot
7.4.3.    Operating business segments
7.4.4.    Product portfolio
7.4.5.    Business performance
7.4.6.    Key strategic moves and developments

7.5.    FORCE-ONE APPLIED MATERIALS

7.5.1.    Company overview
7.5.2.    Company snapshot
7.5.3.    Product portfolio

7.6.    LINTEC OF AMERICA, INC (LINTEC CORPORATION)

7.6.1.    Company overview
7.6.2.    Company snapshot
7.6.3.    Operating business segments
7.6.4.    Product portfolio
7.6.5.    Business performance
7.6.6.    Key strategic moves and developments

7.7.    MITSUI CHEMICALS, INC.

7.7.1.    Company overview
7.7.2.    Company snapshot
7.7.3.    Operating business segments
7.7.4.    Product portfolio
7.7.5.    Business performance

7.8.    NITTO DENKO CORPORATION

7.8.1.    Company overview
7.8.2.    Company snapshot
7.8.3.    Operating business segments
7.8.4.    Product portfolio
7.8.5.    Business performance

7.9.    PANTECH TAPE CO., LTD.

7.9.1.    Company overview
7.9.2.    Company snapshot
7.9.3.    Product portfolio

7.10.    MINITRON ELEKTRONIK GMBH

7.10.1.    Company overview
7.10.2.    Company snapshot
7.10.3.    Product portfolio

LIST OF TABLES

TABLE 01.    COMPARISON BETWEEN UV CURABLE AND NON-UV WAFER BACKGRING TAPES
TABLE 02.    GLOBAL WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018-2026($MILLION)
TABLE 03.    GLOBAL WAFER BACKGRINDING TAPE MARKET VOLUME, BY TYPE, 2018-2026(THOUSAND KG)
TABLE 04.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR UV CURABLE, BY REGION 2018-2026 ($MILLION)
TABLE 05.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR NON-UV, BY REGION 2018-2026 ($MILLION)
TABLE 06.    GLOBAL WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018-2026($MILLION)
TABLE 07.    GLOBAL WAFER BACKGRINDING TAPE MARKET VOLUME, BY WAFER SIZE, 2018-2026(THOUSAND KG)
TABLE 08.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR 6-INCH, BY REGION 2018-2026 ($MILLION)
TABLE 09.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR 8-INCH, BY REGION 2018-2026 ($MILLION)
TABLE 10.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR 12-INCH, BY REGION 2018–2026 ($MILLION)
TABLE 11.    WAFER BACKGRINDING TAPE MARKET REVENUE FOR OTHERS, BY REGION 2018–2026 ($MILLION)
TABLE 12.    WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2018–2026 ($MILLION)
TABLE 13.    WAFER BACKGRINDING TAPE MARKET VOLUME, BY REGION 2018–2026 (THOUSAND KG)
TABLE 14.    NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 15.    NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 16.    U. S. WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 17.    U. S. WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 18.    CANADA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 19.    CANADA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 20.    MEXICO WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 21.    MEXICO WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 22.    EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 23.    EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 24.    U.K. WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 25.    U.K. WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 26.    GERMANY WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 27.    GERMANY WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 28.    FRANCE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 29.    FRANCE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 30.    RUSSIA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 31.    RUSSIA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 32.    REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 33.    REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 34.    ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 35.    ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 36.    CHINA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 37.    CHINA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 38.    JAPAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 39.    JAPAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 40.    TAIWAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 41.    TAIWAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 42.    SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 43.    SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 44.    REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 45.    REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 46.    LAMEA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 47.    LAMEA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 48.    LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 49.    LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 50.    MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 51.    MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 52.    AI TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 53.    AI TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 54.    AMC CO., LTD: COMPANY SNAPSHOT
TABLE 55.    AMC CO., LTD: PRODUCT PORTFOLIO
TABLE 56.    DENKA COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 57.    DENKA COMPANY LIMITED: OPERATING SEGMENTS
TABLE 58.    DENKA COMPANY LIMITED: PRODUCT PORTFOLIO
TABLE 59.    FURUKAWA ELECTRIC CO., LTD.: COMPANY SNAPSHOT
TABLE 60.    FURUKAWA ELECTRIC CO., LTD.: OPERATING SEGMENTS
TABLE 61.    FURUKAWA ELECTRIC CO., LTD.: PRODUCT PORTFOLIO
TABLE 62.    FURUKAWA ELECTRIC CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 63.    FORCE-ONE APPLIED MATERIALS: COMPANY SNAPSHOT
TABLE 64.    FORCE-ONE APPLIED MATERIALS: PRODUCT PORTFOLIO
TABLE 65.    LINTEC OF AMERICA, INC: COMPANY SNAPSHOT
TABLE 66.    LINTEC OF AMERICA, INC: OPERATING SEGMENTS
TABLE 67.    LINTEC OF AMERICA, INC: PRODUCT PORTFOLIO
TABLE 68.    LINTEC OF AMERICA, INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 69.    MITSUI CHEMICALS, INC.: COMPANY SNAPSHOT
TABLE 70.    MITSUI CHEMICALS, INC.: OPERATING SEGMENTS
TABLE 71.    MITSUI CHEMICALS, INC.: PRODUCT PORTFOLIO
TABLE 72.    NITTO DENKO CORPORATION: COMPANY SNAPSHOT
TABLE 73.    NITTO DENKO CORPORATION: OPERATING SEGMENTS
TABLE 74.    NITTO DENKO CORPORATION: PRODUCT PORTFOLIO
TABLE 75.    PANTECH TAPE CO., LTD.: COMPANY SNAPSHOT
TABLE 76.    PANTECH TAPE CO., LTD.: PRODUCT PORTFOLIO
TABLE 77.    MINITRON ELEKTRONIK GMBH: COMPANY SNAPSHOT
TABLE 78.    MINITRON ELEKTRONIK GMBH: PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01.    KEY MARKET SEGMENTS
FIGURE 02.    EXECUTIVE SUMMARY, BY SEGMENTATION
FIGURE 03.    EXECUTIVE SUMMARY, BY GEOGRAPHY
FIGURE 04.    TOP IMPACTING FACTORS
FIGURE 05.    TOP INVESTMENT POCKETS
FIGURE 06.    TOP WINNING STRATEGIES, BY DEVELOPMENT, 2016-2019*
FIGURE 07.    TOP WINNING STRATEGIES, BY COMPANY, 2016-2019*
FIGURE 08.    MODERATE-TO-HIGH BARGAINING POWER OF SUPPLIERS
FIGURE 09.    MODERATE-TO-HIGH THREAT OF NEW ENTRANTS
FIGURE 10.    MODERATE THREAT OF SUBSTITUTES
FIGURE 11.    HIGH-TO-MODERATE INTENSITY OF RIVALRY
FIGURE 12.    HIGH-TO-MODERATE BARGAINING POWER OF BUYERS
FIGURE 13.    MARKET SHARE ANALYSIS (2018)
FIGURE 14.    WAFER MANUFACTURING
FIGURE 15.    WAFER FABRICATION PROCESS
FIGURE 16.    FRONT-END PROCESS: WAFER FABRICATION
FIGURE 17.    BACK END PROCESS: WAFER FABRICATION
FIGURE 18.    WAFER BACKGRINDING PROCESS
FIGURE 19.    GLOBAL WAFER BACKGRINDING TAPE MARKET SHARE, BY TYPE, 2018–2026 (%)
FIGURE 20.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR UV CURABLE, BY COUNTRY, 2018 & 2026 (%)
FIGURE 21.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR NON-UV, BY COUNTRY, 2018 & 2026 (%)
FIGURE 22.    GLOBAL WAFER BACKGRINDING TAPE MARKET SHARE, BY WAFER SIZE, 2018–2026 (%)
FIGURE 23.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR 6-INCH, BY COUNTRY, 2018 & 2026 (%)
FIGURE 24.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR 8-INCH, BY COUNTRY, 2018 & 2026 (%)
FIGURE 25.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR 12-INCH, BY COUNTRY, 2018 & 2026 (%)
FIGURE 26.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR OTHERS, BY COUNTRY, 2018 & 2026 (%)
FIGURE 27.    WAFER BACKGRINDING TAPE MARKET, BY REGION, 2018-2026 (%)
FIGURE 28.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2018–2026 (%)
FIGURE 29.    U.S. WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 30.    CANADA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 31.    MEXICO WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 32.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2018–2026 (%)
FIGURE 33.    U.K. WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 34.    GERMANY WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 35.    FRANCE WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 36.    RUSSIA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 37.    REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 38.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2018–2026 (%)
FIGURE 39.    CHINA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 40.    JAPAN WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 41.    TAIWAN WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 42.    SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 43.    REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 44.    COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2018–2026 (%)
FIGURE 45.    LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 46.    MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, 2018–2026 ($MILLION)
FIGURE 47.    DENKA COMPANY LIMITED: REVENUE, 2016–2018 ($MILLION)
FIGURE 48.    DENKA COMPANY LIMITED: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 49.    FURUKAWA ELECTRIC CO., LTD.: REVENUE, 2016–2018 ($MILLION)
FIGURE 50.    FURUKAWA ELECTRIC CO., LTD.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 51.    FURUKAWA ELECTRIC CO., LTD.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 52.    LINTEC OF AMERICA, INC: REVENUE, 2016–2018 ($MILLION)
FIGURE 53.    LINTEC OF AMERICA, INC: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 54.    MITSUI CHEMICALS, INC.: REVENUE, 2016–2018 ($MILLION)
FIGURE 55.    MITSUI CHEMICALS, INC.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 56.    MITSUI CHEMICALS, INC.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 57.    NITTO DENKO CORPORATION: REVENUE, 2016–2018 ($MILLION)
FIGURE 58.    NITTO DENKO CORPORATION: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 59.    NITTO DENKO CORPORATION: REVENUE SHARE BY REGION, 2018 (%)

 
 

Wafer backgrinding is an integrated process in the fabrication of semiconductor devices. The wafer backgrinding is the process to reduce the thickness of the wafer for stacking and high-density packaging of the integrated circuits. Prior to the process of backgrinding, wafers are laminated by different type of backgrinding tapes, which laminate the wafer against surface damage in the process of backgrinding and also protect from the water surface contamination caused by infiltration of grinding fluid or debris.

Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevents wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Backgrinding process creates a layer of unwanted particles on wafers and circuits which can lead to damage and contamination of the semiconductor material and can hamper the productivity of the devices such as smart devices and consumer electronics. This rise in concern regarding the wafer surface protection during the grinding process to ensure high productivity of the semiconductor devices drives the growth of the market.

UV curable backgrinding tapes support thin semiconductor wafers during the operational process. These UV curable adhesive tapes assist in securing the wafers firmly during the backgrinding process and can be removed easily after exposure. UV curable tapes minimize the contamination of wafer surface and do not require cleaning after backgrinding. UV curable tapes have strong adhesive strength. The adhesive strength becomes lower when the UV light is irradiated. This makes it easy to remove any wafer or chip after irradiation process.

The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.

 

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