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RESULTS FOR TAG: "mems"
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New Silicon on Insulator Market Report
The global silicon on insulator market size was valued at $1.11 billion in 2019, and is projected to reach $3.18 billion by 2027, growing at a CAGR of 14.1% from 2020 to ...
- Report Code : A02760
- Publish Date : Dec 2020
- Pages: 280
- Price From: $ 3,713 T&C:Online Only
Sensor Market Report
The global sensor market was valued at $138,965.0 million in 2017, and is projected to reach $287 billion by 2025, growing at a CAGR of 9.5% from 2019 to 2025.
- Report Code : A00167
- Publish Date : Mar 2020
- Pages: 361
- Price From: $ 4,743 T&C:Online Only
Photomask Market Report
The global photomask market size was valued at $4.00 billion in 2018, and is projected to reach $4.97 billion by 2026, growing at a CAGR of 2.5% from 2019 to 2026. Photomask ...
- Report Code : A05869
- Publish Date : Dec 2019
- Pages: 214
- Price From: $ 3,456 T&C:Online Only
Silicon EPI Wafer Market Report
The global silicon EPI wafer market size was valued at $1.15 billion in 2018, and is projected to reach $1.55 billion by 2026, growing at a CAGR of 4.8% from 2019 to ...
- Report Code : A05856
- Publish Date : Nov 2019
- Pages: 302
- Price From: $ 3,456 T&C:Online Only
Microelectromechanical System (MEMS) Sensor Market Report
The global microelectromechanical system (MEMS) sensor market was valued at $25.7 million in 2018, and is projected to reach $60.6 million by 2026, registering a CAGR of 10.4% from 2019 to 2026. ...
- Report Code : A05780
- Publish Date : Oct 2019
- Pages: 335
- Price From: $ 3,456 T&C:Online Only
Microelectromechanical System (MEMS) Market Report
The global microelectromechanical system market size was valued at $48.74 Billion in 2018, and is projected to reach $122.83 Billion by 2026, registering a CAGR of 11.30% from 2019 to 2026.
- Report Code : A01606
- Publish Date : Oct 2019
- Pages: 182
- Price From: $ 3,456 T&C:Online Only
MEMS Microphone Market Report
MEMS Microphone is a solid-state IC that comprises pressure-sensitive diaphragm embedded on a semiconductor that can be incorporated directly on to an electronic chip along with a small, thin membrane fabricated on ...
- Report Code : A08175
- Upcoming Date : May 2021
- Price From: $ 3,456 T&C:Online Only
Fan-Out Wafer Level Packaging Market Report
Fan-out Wafer Level Packaging (FOWLP) is an integrated circuit (IC) packaging technology that allows simultaneous packaging of several components on the same substrate, hence lowering the overall cost of packaging. FOWLP finds ...
- Report Code : A08259
- Upcoming Date : May 2021
- Price From: $ 3,456 T&C:Online Only
Plasma Etching Equipment Market Report
Plasma Etching equipment is a type of plasma processing device that is used in fabrication process during manufacture of semiconductor devices. This equipment works on the plasma etching technique, which is used ...
- Report Code : A08268
- Upcoming Date : May 2021
- Price From: $ 3,456 T&C:Online Only
Timing Device Market Report
Timing device is a specialized type of clock used to measure the elapsed time interval in hours, minutes, seconds, and fraction of second. Small timing devices are pocket instruments with mechanical movements ...
- Report Code : A08898
- Upcoming Date : May 2020
- Price From: $ 3,456 T&C:Online Only
Active Electronic Components Market Report
The global active electronic components market is experiencing significant growth and will grow considerably in the next few years. An electronic component refers to a basic physical device or entity in an ...
- Report Code : A09985
- Upcoming Date : May 2021
- Price From: $ 3,456 T&C:Online Only
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