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Cosmetic Packaging Market

P

2022

Cosmetic Packaging Market: Global Opportunity Analysis and Industry Forecast, 2020-2030

The global cosmetic packaging market was valued at $34.3 billion in 2020, and is projected to reach $55.9 billion by 2030, growing at a CAGR of 4.8% from 2021 to 2030.

Report Code : A08304 | Pages : 250 | Category : Construction & Manufacturing

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~~$3,456~~ $2,419 (30% Off)

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Inverted Pouch Market

P

2022

Inverted Pouch Market: Global Opportunity Analysis and Industry Forecast, 2021-2031

The global inverted pouch market was valued at $10,640.0 thousand in 2021, and is projected to reach $22,418.2 thousand by 2031, registering a CAGR of 7.6% from 2022 to 2031.

Report Code : A08481 | Pages : 240 | Category : Construction & Manufacturing

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~~$3,570~~ $2,499 (30% Off)

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Child Resistant Packaging Market

P

2022

Child Resistant Packaging Market: Global Opportunity Analysis and Industry Forecast, 2021-2031

The global child resistant packaging market was valued at $23.2 billion in 2021, and is projected to reach $44 billion by 2031, growing at a CAGR of 6.5% from 2022 to 2031.

Report Code : A08693 | Pages : 203 | Category : Construction & Manufacturing

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~~$3,570~~ $2,499 (30% Off)

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Fan-Out Wafer Level Packaging Market

U

2025

Fan-Out Wafer Level Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Fan-out Wafer Level Packaging (FOWLP) is an integrated circuit (IC) packaging technology that allows simultaneous packaging of several components on the same substrate, hence lowering the overall cost ...

Report Code : A08259 | Category : Semiconductor and Electronics

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~~$3,690~~ $2,583 (30% Off)

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Anti-fog Lidding Film Market

P

2022

Anti-fog Lidding Film Market: Global Opportunity Analysis and Industry Forecast, 2021-2031

The global anti-fog lidding film market was valued at $675.8 million in 2021, and is projected to reach $1.3 billion by 2031, growing at a CAGR of 6.7% from 2022 to 2031.

Report Code : A08289 | Pages : 222 | Category : Construction & Manufacturing

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~~$3,570~~ $2,499 (30% Off)

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Digital Printing Packaging Market

P

2022

Digital Printing Packaging Market: Global Opportunity Analysis and Industry Forecast, 2021-2031

The global digital printing packaging market was valued at $20.6 billion in 2021, and is projected to reach $49.9 billion by 2031, growing at a CAGR of 9.1% from 2022 to 2031.

Report Code : A08308 | Pages : 240 | Category : Construction & Manufacturing

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~~$3,456~~ $2,419 (30% Off)

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Cement packaging Market

U

2025

Cement packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Cement packaging is an important factor for any cement producing company as well as for the sellers of the cement. It should be packed in such bags or sacks, which help prevent the cement from getting exposed to the moisture.

Report Code : A08692 | Category : Construction & Manufacturing

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~~$3,690~~ $2,583 (30% Off)

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Clamshell packaging Market

U

2025

Clamshell packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Packaging provides safety and security to the product during the supply chain process such as storage and transportation, by which the quality of the product can be maintained. Clamshell packaging is widely used in different industries such as food & beverage, fruits & vegetables, and electronics.

Report Code : A08694 | Category : Construction & Manufacturing

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~~$3,690~~ $2,583 (30% Off)

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Punnet Packaging Market

U

2025

Punnet Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Punnets is the compact basket that is used for the packaging of vegetable and soft fruits like berries, grapes, cherries, mushrooms, and others.

Report Code : A08709 | Category : Construction & Manufacturing

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~~$3,690~~ $2,583 (30% Off)

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Returnable Packaging Market

P

2022

Returnable Packaging Market: Global Opportunity Analysis and Industry Forecast, 2021-2031

The global returnable packaging market was valued at $103.7 billion in 2021, and is projected to reach $191.7 billion by 2031, growing at a CAGR of 6.2% from 2022 to 2031.

Report Code : A08712 | Pages : 260 | Category : Construction & Manufacturing

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~~$3,570~~ $2,499 (30% Off)

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Foam Plastics Market

P

2020

Foam Plastics Market: Global Opportunity Analysis and Industry Forecast, 2020–2027

The global foam plastics market was valued at $102.0 billion in 2019, and is projected to reach $123.7 billion by 2027, growing at a CAGR of 3.3% from 2020 to 2027.

Report Code : A08762 | Pages : 282 | Category : Materials and Chemicals

Price:

~~$3,456~~ $2,730 (21% Off)

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Ethyl Acetate Market

P

2023

Ethyl Acetate Market: Global Opportunity Analysis and Industry Forecast, 2021 - 2031

The global ethyl acetate market was valued at $5.7 billion in 2021, and is projected to reach $10.3 billion by 2031, growing at a CAGR of 6.1% from 2022 to 2031.

Report Code : A09011 | Pages : 512 | Category : Materials and Chemicals

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~~$3,570~~ $2,499 (30% Off)

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Tinplate Packaging Market

U

2025

Tinplate Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Tinplate packaging is an important type of packaging of products. Tinplate is a plate that consists of steel, which is coated with tin. This coating prevents the tinplate ...

Report Code : A08723 | Category : Construction & Manufacturing

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~~$3,690~~ $2,583 (30% Off)

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Technical Foam Market

P

2020

Technical Foam Market: Global Opportunity Analysis and Industry Forecast, 2020–2027

The global technical foam market size was valued at $31.3 billion in 2019, and is projected to reach $50.7 billion by 2027, growing at a CAGR of 6.2% from 2020 to 2027.

Report Code : A08856 | Pages : 330 | Category : Materials and Chemicals

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~~$3,456~~ $2,627 (24% Off)

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Outsourced Semiconductor Assembly and Testing Market

P

2022

Outsourced Semiconductor Assembly and Testing Market: Global Opportunity Analysis and Industry Forecast, 2021 - 2031

The global outsourced semiconductor assembly and testing market size was valued at $34.6 billion in 2021, and is projected to reach $60.3 billion by 2031, growing at a CAGR of 6.3% from 2022 to 2031.

Report Code : A08874 | Pages : 225 | Category : Semiconductor and Electronics

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~~$3,570~~ $2,499 (30% Off)

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Ball Grid Array (BGA) Packaging Market

U

2025

Ball Grid Array (BGA) Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line ...

Report Code : A08890 | Category : Semiconductor and Electronics

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~~$3,690~~ $2,583 (30% Off)

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Wine Corks Market

P

2021

Wine Corks Market: Global Opportunity Analysis and Industry Forecast 2021–2027

The wine corks market size was valued at $20.8 billion in 2019, and is projected to reach $27.6 billion by 2027, growing at a CAGR of 7.4% from 2021 to 2027.

Report Code : A09159 | Pages : 155 | Category : Consumer Goods

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~~$3,841~~ $2,842 (26% Off)

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Silicon Metal Market

P

2021

Silicon Metal Market: Global Opportunity Analysis and Industry Forecast, 2020–2027

The global silicon metal market size was valued at $6.3 billion in 2019, and is projected to reach $8.9 billion by 2027, growing at a CAGR of 5.5% from 2020 to 2027.

Report Code : A09262 | Pages : 235 | Category : Materials and Chemicals

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~~$3,456~~ $2,765 (20% Off)

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High Performance Computing (HPC) Chipset Market

P

2023

High Performance Computing (HPC) Chipset Market: Global Opportunity Analysis and Industry Forecast, 2022 - 2032

The global high performance computing (hpc) chipset market was valued at $5.7 billion in 2022, and is projected to reach $29.4 billion by 2032, growing at a CAGR of 17.9% from 2023 to 2032.

Report Code : A09454 | Pages : 240 | Category : Semiconductor and Electronics

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Corrugators Market

P

2022

Corrugators Market: Global Opportunity Analysis and Industry Forecast, 2021 - 2031

The global corrugators market was valued at $2.7 billion in 2021, and is projected to reach $4.2 billion by 2031, growing at a CAGR of 4.2% from 2022 to 2031.

Report Code : A09630 | Pages : 289 | Category : Construction & Manufacturing

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~~$3,570~~ $2,499 (30% Off)

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Wood Pulp Market

P

2021

Wood Pulp Market: Global Opportunity Analysis and Industry Forecast, 2021–2030

The global wood pulp market was valued at $165.3 billion in 2020, and is projected to reach $242.1 billion by 2030, growing at a CAGR of 3.9% from 2021 to 2030.

Report Code : A09862 | Pages : 230 | Category : Materials and Chemicals

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Silicon Wafer Market

P

2024

Silicon Wafer Market: Global Opportunity Analysis and Industry Forecast, 2022 - 2032

The global silicon wafer market was valued at $15.4 billion in 2022, and is projected to reach $25.9 billion by 2032, growing at a CAGR of 5.4% from 2023 to 2032.

Report Code : * A09975 | Pages : 250 | Category : Semiconductor and Electronics

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Semiconductor Packaging Market

P

2021

Semiconductor Packaging Market: Global Opportunity Analysis and Industry Forecast, 2021–2030

The global semiconductor packaging market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.

Report Code : A09496 | Pages : 425 | Category : Semiconductor and Electronics

Price:

~~$3,713~~ $2,859 (23% Off)

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Through-Silicon Via (TSV) IC Packaging Market

U

2025

Through-Silicon Via (TSV) IC Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

A through-silicon via (TSV) or through-chip via in electronic engineering is a vertical electrical connection (via) that needs to pass or dies entirely through a silicon wafer. TSVs ...

Report Code : A09770 | Category : Semiconductor and Electronics

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~~$3,690~~ $2,583 (30% Off)

License: Cloud Access

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Bonding Wire Packaging Market

U

2025

Bonding Wire Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032

Wire bonding is the technology in which an integrated circuit (IC) or other semiconductor device is interconnected using its packaging during the production of semiconductor devices. Wire bonding ...

Report Code : A09771 | Category : Semiconductor and Electronics

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~~$3,690~~ $2,583 (30% Off)

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The global cosmetic packaging market was valued at $34.3 billion in 2020, and is projected to reach $55.9 billion by 2030, growing at a CAGR of 4.8% from 2021 to 2030.

The global inverted pouch market was valued at $10,640.0 thousand in 2021, and is projected to reach $22,418.2 thousand by 2031, registering a CAGR of 7.6% from 2022 to 2031.

The global child resistant packaging market was valued at $23.2 billion in 2021, and is projected to reach $44 billion by 2031, growing at a CAGR of 6.5% from 2022 to 2031.

Fan-out Wafer Level Packaging (FOWLP) is an integrated circuit (IC) packaging technology that allows simultaneous packaging of several components on the same substrate, hence lowering the overall cost ...

The global anti-fog lidding film market was valued at $675.8 million in 2021, and is projected to reach $1.3 billion by 2031, growing at a CAGR of 6.7% from 2022 to 2031.

The global digital printing packaging market was valued at $20.6 billion in 2021, and is projected to reach $49.9 billion by 2031, growing at a CAGR of 9.1% from 2022 to 2031.

Cement packaging is an important factor for any cement producing company as well as for the sellers of the cement. It should be packed in such bags or sacks, which help prevent the cement from getting exposed to the moisture.

Packaging provides safety and security to the product during the supply chain process such as storage and transportation, by which the quality of the product can be maintained. Clamshell packaging is widely used in different industries such as food & beverage, fruits & vegetables, and electronics.

Punnets is the compact basket that is used for the packaging of vegetable and soft fruits like berries, grapes, cherries, mushrooms, and others.

The global returnable packaging market was valued at $103.7 billion in 2021, and is projected to reach $191.7 billion by 2031, growing at a CAGR of 6.2% from 2022 to 2031.

The global foam plastics market was valued at $102.0 billion in 2019, and is projected to reach $123.7 billion by 2027, growing at a CAGR of 3.3% from 2020 to 2027.

The global ethyl acetate market was valued at $5.7 billion in 2021, and is projected to reach $10.3 billion by 2031, growing at a CAGR of 6.1% from 2022 to 2031.

Tinplate packaging is an important type of packaging of products. Tinplate is a plate that consists of steel, which is coated with tin. This coating prevents the tinplate ...

The global technical foam market size was valued at $31.3 billion in 2019, and is projected to reach $50.7 billion by 2027, growing at a CAGR of 6.2% from 2020 to 2027.

The global outsourced semiconductor assembly and testing market size was valued at $34.6 billion in 2021, and is projected to reach $60.3 billion by 2031, growing at a CAGR of 6.3% from 2022 to 2031.

Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line ...

The wine corks market size was valued at $20.8 billion in 2019, and is projected to reach $27.6 billion by 2027, growing at a CAGR of 7.4% from 2021 to 2027.

The global silicon metal market size was valued at $6.3 billion in 2019, and is projected to reach $8.9 billion by 2027, growing at a CAGR of 5.5% from 2020 to 2027.

The global high performance computing (hpc) chipset market was valued at $5.7 billion in 2022, and is projected to reach $29.4 billion by 2032, growing at a CAGR of 17.9% from 2023 to 2032.

The global corrugators market was valued at $2.7 billion in 2021, and is projected to reach $4.2 billion by 2031, growing at a CAGR of 4.2% from 2022 to 2031.

The global wood pulp market was valued at $165.3 billion in 2020, and is projected to reach $242.1 billion by 2030, growing at a CAGR of 3.9% from 2021 to 2030.

The global silicon wafer market was valued at $15.4 billion in 2022, and is projected to reach $25.9 billion by 2032, growing at a CAGR of 5.4% from 2023 to 2032.

The global semiconductor packaging market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.

A through-silicon via (TSV) or through-chip via in electronic engineering is a vertical electrical connection (via) that needs to pass or dies entirely through a silicon wafer. TSVs ...

Wire bonding is the technology in which an integrated circuit (IC) or other semiconductor device is interconnected using its packaging during the production of semiconductor devices. Wire bonding ...